iFixit has already released their teardown of the new MacBook Airs, finding that most of the machine’s internal parts are the same as the previous generation MacBook Air. Most notably however, was the discovery that Apple has stuck with the same solid state storage design as they used in the previous generation MacBook Air. That […]
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A Look At iFixit’s Teardown of the New MacBook Air

Jul 25th 2011 by
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iFixit has already released their teardown of the new MacBook Airs, finding that most of the machine’s internal parts are the same as the previous generation MacBook Air.

Most notably however, was the discovery that Apple has stuck with the same solid state storage design as they used in the previous generation MacBook Air. That is, flash storage modules soldered to a detachable board. This allows users to replace, or upgrade storage if and when they need to. A report prior to the release of the new machines, suggested that Apple would be utilizing new Toggle DDR 2.0 which would consume less power and be soldered directly to the logic board.

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Next iFixit found two chips from Broadcom on the new machines’ wireless card- BCM4322 Wi-Fi chip and a BCM20702 Bluetooth 4.0 chip. Bluetooth 4.0 is a new technology which offers lower power consumption, decreased latency, and better security.

The last of the major new finds is the fiber optics cables running under the keyboard to evenly distribute light. This comes as no surprise however, as Apple reintroduced backlighting to the MacBook Air, after it was stripped out of the Air line last fall with the then-current refresh.

Of course, this is just iFixit’s preliminary teardown, and they are planning further dig into new technologies such as the Thunderbolt connectivity included in the new MacBook Airs. They do such great work.

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